 PTH Treatment Process : ( 貫孔電鍍制程 )
A PTH process has the function, to build up a conductive layer on the nonconductive areas. The classical PTH process based on electroless copper is most widely in operation and provides a high reliability. Jetchem's alkaline activator system, provides a very dense and uniform Palladium layer, with an excellent initial coverage power to the electroless copper.
貫孔電鍍制程主要于PCB非導(dǎo)電區(qū)域形成導(dǎo)電層。傳統(tǒng)化學(xué)銅方式為最穩(wěn)定、信賴(lài)度最高的方法。超特提供鹼性的純肥系統(tǒng)，把能密集且均勻吸附于非導(dǎo)電區(qū)域，形成良好催化環(huán)境，使化學(xué)銅能完整覆蓋。
Type of Electroless copper : ( 多種化學(xué)銅型態(tài) )
Low Speed (Tartaric or EDTA): / 薄銅
Electroless Copper 168 μm/h : 1.2 - 1.7
Electroless Copper ECT μm/h : 1.2 - 1.7
Electroless Copper ECT-H μm/h : 1.8 - 2.5
Electroless Copper EC μm/h : 0.7 - 1.3
|
Medium Speed (Based on Tartaric acid) 中速銅 |
| |
Electroless Copper MC μm/h : 2.6 - 3.0 |
| |
 |
| |
|
| |
High Speed (Based on Quadrol) 厚化銅 |
| |
Electroless Copper 910 μm/h : 4.0 - 6.0 |
| |
 | |
